Durability and reliability of wide-bandgap materials such as SiC and GaN are an important topic. The focus here is on new failure mechanisms whose effects are not visible with traditional H(3)TRB/HTGS – but which nevertheless have an influence on the real application.
This gap in the qualification is closed by dynamic tests, whose requirements clearly exceed the previous test procedures and which are more strongly oriented to the application.
For dynamic H3TRB, HTGB (HTGS) and RTGB (RTGS) test systems, SET offers systems that convert the extended requirements from industry into automated dynamic tests. Special focus is put on flexibility in order to be able to quickly cover changing requirements.
Go to system features ↓
Features of Dynamic Semiconductor Test Systems
Key Benefits of dynamic HTGB (HTGS) and RTGB (RTGS) test system:
- 40 Test channels
- Gate V+ and V- SW configurable, Wide Bandgap Compatible
- Gate du/dt configurable
- Stress Frequency up to 300khz
- In-situ Gate Threshold measurement
- Hot/cool Plate for DUTs, -10°C to 200°C
The conventional, static H3TRB essentially tests the behavior of a component under voltage and at high humidity. This can lead to various effects in the device, including the corrosion of materials when static voltage is applied.
In the application, however, high voltage changes occur in addition to the static voltage, especially with the new wide bandgap technologies (SiC/GAN). Due to the constant field changes, these voltage changes significantly accelerate possible corrosion. This can lead to a much earlier failure of the semiconductors in the application than would be expected by the static H3TRB test.
The SET offers as an extension to existing H(3)TRB systems a dynamic stimulus of discrete components or modules in the H3TRB test. This test with dynamic components is especially for applications with high voltage changes a prerequisite to make solid statements about the lifetime.
Key Benefits of dynamic H3TRB test system:
- 40/80/160/240 Test channels
- Voltage Range SW Configurable up to 1200V
- Frequencies up to 350khz
Research, development & standardization
In order to prove the relevance of dynamic lifetime tests, SET GmbH has carried out test setups in its research & development department, defined parameters and subjected several commercially available SiC components to dynamic HTGS and H3TRB tests using one of the most common measuring methods.
In addition, SET is co-chair of the ECPE working group on Guideline AQG 324, where it is developing European qualification guidelines for power modules in converters in motor vehicles in order to unify and standardize the new test requirements throughout the industry.