The Power Semiconductor Reliability Round Table is our expert conference format regarding today’s and future challenges in Power Semiconductor Reliability Testing. The event series is hosted in cooperation with the ECPE e.V. – European Center for Power Electronics e.V. – and the Cluster of Power Electronics. It is held as an Online Conference. The next event takes place on the 4th of February 2021 from 3:00 pm – 6:00 pm (UTC+1).
Key Topic: Challenges in Wide Bandgap Qualification
In 2021, the Power Semiconductor Reliability Round Table is dedicated to reliability testing of Wide-Bandgap Materials. The focus is on new challenges in qualification of SiC and GaN such as dynamic H3TRB, dynamic HTGB and dynamic RTGB testing.
Lifetime and reliability of Wide-Bandgap materials such as SiC are a cutting-edge topic. The new materials bring up completely new requirements, technology demands and test procedures which challenge the whole industry. The demand for dynamic H3TRB, HTGB and RTGB tests has risen extremely, but exact requirements are often hardly known yet.
Conference format: Active participation
The event is free of charge, but it depends on the contributions of all participants – especially since it again takes place online in 2021. That is why we ask you to share your experiences, challenges or findings at the Round Table. The attendees of previous round tables jointly confirmed that the event with its open format offered great added value for them. We will continue in 2021 with the combination of 10 minute presentations and about 10 minute discussions.
„Do your part and share your challenges, requirements or solutions in a short presentation.“
We look forward to welcoming you!